Foxconn & Stellantis's SiliconAuto Adopts Siemens' PAVE360
SiliconAuto is a joint venture established by Foxconn and Stellantis in 2023 to design and supply state-of-the-art semiconductors for the automotive sector.
The brand has just adopted Siemens PAVE360 software, an innovative digital twin solution, to speed up the development of its advanced driver-assistance systems (ADAS) system on a chip (SoC).
The software will provide a vital virtual reference development environment, which SiliconAuto needs prior to silicon hardware availability.
Through this both organisations are helping to create semiconductor solutions that heighten the efficiency, safety and performance of software-defined vehicles at every development stage.
Siemens: A digital twin leader
Siemens has established itself as a leader in digital twin technology, leveraging its expertise across various industries. Siemens offers digital twins that address products, production and performance, embracing them to digitise the value chain.
Digital twins from Siemens are being applied across industries, including manufacturing to aid in engineering, product development and virtual commissioning.
Siemens is actively expanding its digital twin capabilities through strategic partnerships, including it's open partner digital twin ecosystem the Siemens Xcelerator and its collaboration with Nvidia to develop photorealistic digital twins for manufacturing enterprises.
By connecting its software platform with Nvidia's Omniverse platform, Siemens is seeking to create an industrial metaverse that heavily utilises digital twins.
SiliconAuto: semiconductor innovation
SiliconAuto brings together Stellantis' extensive knowledge of automotive standards and needs with Foxconn's electronics manufacturing experience.
The semiconductors they design are specifically tailored to the automotive industry, addressing the needs of a new generation of industry vehicle platforms.
The automotive sector is rapidly changing, becoming more reliant on software and digital technologies with the rise of EVs and Software-Defined Vehicles.
Stellantis and Foxconn have recognised this fact and responded accordingly through SiliconAuto.
The venture intends to start supplying semiconductors from 2026.
“SiliconAuto’s commitment to driving innovation in the automotive industry is exemplified by our collaboration with Siemens, says Shawn Tien, Vice President of Sales and Marketing, SiliconAuto.
"By leveraging PAVE360, we are not just accelerating development but also paving the way for future-ready vehicles that meets the highest standards of safety and performance,”
Siemens PAVE360 will enable SiliconAuto to create a comprehensive automotive standards-based virtual development environment.
This environment will be multi-fidelity and multi-client, combining virtual SoCs and real-world inputs with existing models and tooling.
SiliconAuto will be able to greater pursue early software development, gain early insight and provide key metrics for decision through this digital twin software.
“The pace of development for the advanced technologies required for next generation electric vehicles is accelerating - OEMs and suppliers need to be able to prove out, simulate and iterate software capabilities long before hardware becomes available,” says David Fritz, vice president, Hybrid and Virtual Systems, Siemens Digital Industries Software.
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