Intel: Spearheading US Semiconductor Manufacturing

On Monday the Biden-Harris Administration announced that Intel has been awarded up to US$3bn in direct funding under the CHIPS and Science Act for the Secure Enclave program. 

The CHIPS and Science Act, passed by Congress in 2022, provides US$52.7bn for American semiconductor development, research and manufacturing.

Intel reached an agreement with the Biden-Harris Administration back in March of this year to support the construction and modernisation of commercial semiconductor fabrication facilities. 

The Secure Enclave program builds on previous projects between Intel and the Department of Defense (DoD), such as Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) and State-of-the-Art Heterogeneous Integration Prototype (SHIP). 

Intel, as the only American company that both designs and manufactures leading-edge logic chips, has critical semiconductor manufacturing and research sites in New Mexico, Ohio, Oregon and Arizona. 

The company is helping to secure the US’s domestic chip supply chain and enhance the resilience of national technological systems.

Continued collaboration with the DoD

“Intel is proud of our ongoing collaboration with the US Department of Defense to help strengthen America’s defence and national security systems,” says Chris George, president and general manager of Intel Federal. 

“Today’s announcement highlights our joint commitment with the US government to fortify the domestic semiconductor supply chain and to ensure the United States maintains its leadership in advanced manufacturing, microelectronics systems, and process technology.”

Intel Foundry, which unites all the components customers need to design and manufacture sophisticated chips, continues to undergo further development. 

Intel 18A, the company’s most advanced design and process technology yet, is on track for production in 2025. 

Intel has been closely collaborating with the US DoD for many years, particularly as semiconductors have grown in importance. 

Back in 2020, the manufacturer was awarded the second phase of the SHIP program, which enabled the U.S. government to access Intel’s semiconductor packaging capabilities in Oregon and Arizona whilst leveraging the company’s substantial annual R&D and manufacturing investments. 

In 2021 Intel also agreed to provide commercial foundry services for multiple parts of the DoD’s RAMP-C program.

This program utilises US commercial semiconductor foundries to produce integrated and custom circuits for critical DoD systems.

Intel: spearheading US semiconductor manufacturing

Since these agreements, Intel has successfully delivered the first multi-chip package prototypes under the SHIP program.

Achieved in 2022, this allowed the DoD to modernise and embrace advanced microelectronics packaging. 

Intel has also successfully onboarded key Defence Industrial Base (DIB) customers, including manufacturers like Boeing, and Northrop Grumman and software companies like Microsoft, Nvidia and IBM.

Through these partnerships, the company has progressed in developing early DIB product prototypes.

Such progress showcases the robustness of Intel’s ecosystem solutions for high-volume manufacturing, the strength of its intellectual property and the sophistication of its 18A process technology. 

This progress showcases the readiness of Intel’s 18A process technology, intellectual property and ecosystem solutions for high-volume manufacturing. 

Intel’s advancement of US semiconductor manufacturing will only continue with the direct funding provided by the Biden-Harris Administration.

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